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Sample Preparation and Cross-Sectional Analysis
Sample Preparation and Cross-Sectional Analysis
Sample preparation and cross-sectional analysis are essential techniques used in materials science and engineering to prepare samples for microscopy and analyze their internal structure and composition. Sample preparation involves various methods such as cutting, polishing, mounting, embedding, and sectioning, which are tailored to the specific properties and requirements of the material under investigation. Cross-sectional analysis encompasses techniques such as scanning electron microscopy (SEM), transmission electron microscopy (TEM), focused ion beam (FIB) and milling, which provide detailed information about the morphology, microstructure, and composition of materials at different length scales.
Accurate sample preparation and cross-sectional analysis provide valuable insights into material properties, defects, interfaces, and failure mechanisms, supporting research, development, and quality control in various industries including semiconductors, metals, ceramics, polymers, and composites. In semiconductor manufacturing, it aids in characterizing device structures, metallization layers, and interconnects for integrated circuits, MEMS devices, and nanoelectronics. In materials science and metallurgy, it supports the analysis of microstructural features, phase transformations, and mechanical properties in metals, alloys, and ceramics. Moreover, sample preparation and cross-sectional analysis play a crucial role in failure analysis, materials characterization, and product development by identifying defects, analyzing fracture surfaces, and investigating material-property relationships in components, devices, and materials.