Focused Ion Beam

The Focused Ion Beam (FIB) technique operates through a sequence of meticulously controlled steps. It begins with the ion source, where a liquid metal ion source (LMIS), typically employing gallium, generates a focused beam of energetic ions. This ion beam is then directed through a series of electrostatic lenses and deflectors, which focus and precisely control its position on the sample surface. As the finely focused ion beam interacts with the sample material, it facilitates various processes, including material removal (milling), imaging, deposition, and analysis. During this interaction, secondary electrons or ions are produced, which are subsequently detected to create high-resolution images of the sample surface. This imaging capability allows for detailed examination and manipulation of the sample at the micro and nano scales, making FIB a powerful tool in material science and semiconductor research.

• Failure analysis of aerospace components
• Characterization of aerospace materials
• Micro-machining and prototyping

• Defect analysis in automotive components
• Material characterization and quality control
• Micro-machining and prototyping

• Analysis of catalyst materials
• Characterization of polymer and composite materials
• Micro-machining and prototyping

• Failure analysis and defect characterization
• Integrated circuit (IC) editing and modification
• Micro-machining and prototyping

• Analysis of materials used in defence applications
• Failure analysis of defence components
• Micro-machining and prototyping

• Characterization of energy materials (e.g., batteries, solar cells)
• Failure analysis of energy components
• Micro-machining and prototyping

• Forensic analysis of materials and evidence
• Failure analysis and root cause investigations
• Micro-machining for evidence preparation

• Characterization of lighting materials and devices
• Failure analysis of LED components
• Micro-machining and prototyping

• Analysis of medical device materials and coatings
• Failure analysis of medical implants
• Micro-machining for medical device development

• Characterization of pharmaceutical materials
• Failure analysis of pharmaceutical components
• Micro-machining for drug delivery systems

• Analysis of raw materials (e.g., minerals, metals, ceramics)
• Characterization of material properties
• Micro-machining for material processing

• Integrated circuit (IC) editing and modification
• Failure analysis and defect characterization
• Micro-machining and prototyping

• Failure analysis of telecommunication components
• Characterization of data storage materials
• Micro-machining for device development

• High-resolution imaging and analysis capabilities at the micro- and nanoscale.
• Precise material removal (milling) and deposition capabilities.
• Ability to modify and edit integrated circuits (ICs) and other micro-devices.
• Site-specific sample preparation and cross-sectioning for further analysis.
• Versatility in analyzing a wide range of materials, including metals, ceramics, polymers, and composites.

The FIB technique can analyze a wide range of solid samples, including bulk materials, thin films, and micro-devices. Sample size is typically limited to a few millimeters or smaller, as the analysis area is highly localized. Sample preparation may be required, such as mounting, polishing, or coating, depending on the specific material and analysis requirements.